我采用了MSP430F5528IRGCT，现有一批IC开封后没有在期限内消耗，需要烘烤。我查阅了JEDEC标准后发现载带有高低温载带的区分，具体内容如下：
我想咨询MSP430F5528IRGCT采用的是高温载带还是低温载带？载带可以耐受几度的烘烤条件？
↧
Channel:
MSP 低功耗微控制器论坛 - 最近的话题
X
Are you the publisher?
Claim or
contact us
about this channel.
X
0
Channel Details:
- Title: MSP 低功耗微控制器论坛 - 最近的话题
- Channel Number: 60085223
- Language: Chinese
- Registered On: February 27, 2016, 7:09 pm
- Number of Articles: 3634
- Latest Snapshot: May 5, 2022, 10:22 am
- RSS URL: http://www.deyisupport.com/question_answer/microcontrollers/msp430/f/55/rss.aspx?mode=0
- Publisher: https://e2echina.ti.com/support/microcontrollers/msp430/f/msp-low-power-microcontroller-forum
- Description:
- Catalog: //mainlander66.rssing.com/catalog.php?indx=60085223
© 2025 //www.rssing.com